HPMC F 50

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  • HPMC F 50

PRODUCTS DETAILS

HPMC F 50 Hydroxypropyl Methyl Cellulose (HPMC)
Physical Analysis
Appearance White to slightly off-white fibrous or granular powder.
Identification A to E Conform
Solution appearance Conform
Methoxy 27.0-30.0%
Hydroxypropoxy 4.0-7.5%
Loss on drying 5.0% Max
Residue on ignition 1.5% Max
pH 5.0-8.0
Apparent viscosity 40-60cps
Particle size Min. 98% pass through 100 mesh
Heavy Metals
Heavy Metal ≤10ppm
Arsenic ≤3ppm
Lead ≤3ppm
Mercury ≤1ppm
Cadmium ≤1ppm
Micro bacteria
Total plate count ≤1000cfu/g
Yeast and Mould ≤100cfu/g
Coli form Absent/g
Salmonella Absent/g
EipponCell HPMC F 50 is a significant dispersant used in the polyvinyl chloride (PVC) industry. During the suspension polymerization of vinyl chloride, it performs several functions. Firstly, it reduces the interfacial tension between vinyl chloride monomer (VCM) and water, facilitating the uniform and stable dispersion of VCM in the aqueous medium. Secondly, it prevents the merging of VCM droplets at the initial stage of polymerization. Lastly, it inhibits coalescence between polymer particles in the intermediate and later stages of the process. In the suspension polymerization system, EipponCell HPMC F 50 plays a dual role of dispersing VCM and ensuring stability. Polyvinyl chloride (PVC) resin with a low degree of polymerization typically refers to PVC resin with a polymerization degree below 800. This type of resin, owing to its low molecular weight, high apparent density, good melt fluidity, short plasticizing time, and ease of processing, finds extensive applications in sheet manufacturing, injection molding pipe fittings, blow molding, and the production of modified resins (such as chlorinated polyvinyl chloride via deep chlorination of vinyl chloride resin), among others. However, PVC resin with a low degree of polymerization exhibits low porosity and compact resin particles. The particle film formed by the graft copolymerization of dispersants and vinyl chloride tends to be relatively thick, which can impact the resin's processing performance and subsequent modification.

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